SK hynix LPDDR5X Achieves ASIL-D, the Highest Automotive Memory Functional Safety Rating January 19, 2026 TECH&AI ASIL-D Automotive Memory DRAM ISO ISO26262 LPDDR5X
SK hynix CEO Kwak Noh-Jung Finds Way Forward for AI Memory on the Ground at CES 2026 January 8, 2026 TECH&AI AI Memory CES 2026 HBM HBM4 Partnerships
SK hynix Showcases Next-Generation AI Memory Innovations at CES 2026 January 5, 2026 PRESS AI Memory CES 2026 HBM4 LPDDR6 NAND Flash SOCAMM2
2026 Market Outlook – “Focus on the HBM-Led Memory Supercycle” January 5, 2026 FACT IR AI Memory HBM3E HBM4 semiconductor market
CEO’s 2026 New Year Message January 2, 2026 PRESS AI Memory Full-Stack AI Memory Creator One team spirit Vision
SK hynix First to Complete Intel Data Center Certification for 32Gb Die-based 256GB Server DDR5 RDIMM December 17, 2025 PRESS 256 GB DDR5 RDIMM DDR5 RDIMM Intel Intel Xeon 6 Server modules
[The Age of Semiconductors] Could Memory Chips Make Relationships With Humanoids a Reality? December 15, 2025 TECH&AI ACIM AI Memory Humanoids Neuromorphic Computing PIM Robotics The Age of Semiconductors
SK hynix Honored with Two Major Titles at GSA Awards 2025 December 6, 2025 PRESS Awards Financial Management GSA Awards 2025
SK hynix Honored for Social Contribution Efforts at the 14th Korea Sharing National Awards December 2, 2025 STORY Awards CSR Korea Sharing National Awards Minister of Health and Welfare Commendation Social Contributions Social Value
SK hynix at SC25: Showcasing Advanced AI Memory From HBM4 to Next-Gen Storage November 28, 2025 TECH&AI AI Memory HBM4 HPC SC25 Supercomputing
SK hynix Redefines Its Vision at SK AI Summit 2025: From AI Memory Provider to “Creator” November 20, 2025 TECH&AI AI Memory Full-Stack AI Memory Creator SK AI Summit SK AI Summit 2025 Vision
SK hynix Showcases Full-Stack AI Memory Portfolio at 2025 OCP Global Summit October 31, 2025 TECH&AI 2025 OCP Global Summit AI Memory AiM Data centers HBM4 OCP Global Summit