[Tech Note EP.1] ‘It’s the Memory’, The Future of AI Will Be Decided by Memory May 12, 2026 TECH&AI AI HBF HBM Physical AI Yongin Semiconductor Cluster
The Economics of Reviving Struggling Regions Through Corporate-Led Initiatives April 27, 2026 TECH&AI Advanced Packaging Balanced Regional Development P&T7 Package Regional Revitalization semiconductor industry
SK hynix received 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM April 25, 2026 PRESS AI HBM IEEE
“Overcoming Technological Limits Requires the Integration of Memory and Logic”: SK hynix Presents Vision at TSMC Symposium April 23, 2026 TECH&AI HBM HBM3E HBM4 TSMC
SK hynix Announces 1Q26 Financial Results April 22, 2026 PRESS IR Earnings First Quarter 2026 Quarterly Earnings
Q1 2026 Earnings Conference Call Invitation April 22, 2026 PRESS IR Invitation Letter Quartely Earnings
What Does P&T7 Mean for Cheongju? A New AI Memory Production Hub and Catalyst for the Local Economy April 22, 2026 TECH&AI Advanced Packaging AI Memory Balanced Regional Development P&T7 Regional Revitalization
SK hynix Vice President Woopyo Jeong Receives Order of Science and Technology Merit, Doyak Medal at National Science and Information and Communications Day Ceremony April 21, 2026 STORY Executive Interview NAND National Science Day TLC
“Shaping the AI Era Together,” SK hynix Unveils Shared Growth Strategy with Partner Companies April 20, 2026 STORY One-team partnership shared growth Shared Growth Committee Sustainable management
SK hynix Begins Mass Production of 192GB SOCAMM2 ‘Setting a New Standard for AI Server Memory Performance’ April 19, 2026 PRESS LPDDR5X SOCAMM2
SK hynix Hosts 2026 Happiness Sharing Fund Donation Ceremony, Reaffirming the Value of Sharing Through Running Together April 15, 2026 STORY ESG Happiness Sharing Fund Social Value Sustainable management SV
SK hynix Begins Supply of 321-layer QLC NAND cSSD, Reinforcing AI PC Storage Leadership April 8, 2026 TECH&AI 321-layer 4D NAND AI NAND Flash PQC21 QLC