Clarification Regarding Recent Media Reports on Solidigm
October 1, 2026
WHAT'S NEW
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[AI infrastructure insight] Why power and cooling have become the next challenge for AI data centersSeptember 30, 2026 -
“Behind AI’s Rapid Growth Lies Memory” — SK hynix Shares Its Next-Generation Memory Portfolio at the TSMC OIP ConferenceSeptember 28, 2026 -
SK hynix Hosts ‘2026 Global Forum,’ Sharing Its Technology Vision and Future Strategy for the AI EraSeptember 21, 2026 -
SK hynix Launches ‘SK hynix Ventures’ in Silicon Valley to Expand Global AI Ecosystem InvestmentSeptember 18, 2026 -
SK hynix Presents ‘New Spectrum’ for AI Infrastructure at ‘AI Infra Summit 2026’September 17, 2026 -
No plans have been confirmed regarding the reported talks between SK hynix and Intel on memory chip production in the U.S.September 16, 2026
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SK hynix Charts Its Business and Technology Direction at the 2026 Future Forum—”Now Is the Golden Time to Leap Forward”September 9, 2026 -
[AI Ecosystem] The real bottleneck: Data, not computeSeptember 3, 2026 -
[AI Infrastructure Insight] Why faster GPUs alone can’t deliver AI performanceAugust 31, 2026 -
SK hynix Indiana fab breaks ground as new hub for US AI innovationAugust 28, 2026 -
SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”August 28, 2026