SK hynix Obtains Industry’s First Validation for 1anm DDR5 DRAM on the 4th Gen Intel® Xeon® Scalable Processor January 12, 2023 Media DDR DRAM
SK hynix Obtains Industry’s First Validation for 1anm DDR5 DRAM on the 4th Gen Intel® Xeon® Scalable Processor January 12, 2023 Media DDR DRAM
SK hynix Obtains Industry’s First Validation for 1anm DDR5 DRAM on the 4th Gen Intel® Xeon® Scalable Processor January 12, 2023 PRESS DDR5 DRAM Intel SK hynix Xeon
SK hynix Issues Industry’s First Sustainability-Linked Bond January 10, 2023 PRESS ESG Green Bond SLB Social Value Sustainability-Linked Bond
SK hynix Presents Its Green Digital Solution at CES 2023 January 6, 2023 TECH&AI Carbon-Free Future CES2023 CXL ESG GDDR6-AiM Green Digital Solution HBM3 PRISM PS1010 E3.S SK hynix TeamSK
SK hynix’s Vice Chairman Park Jung-ho Meets with Qualcomm CEO at CES 2023 for Greater Collaboration in Semiconductor Business January 5, 2023 PRESS DDR5 HBM3 Partnership Qualcomm SK hynix
Semiconductor Front-End Process Episode 3: Forming Patterns on Wafers Through Photolithography January 5, 2023 TECH&AI front-end process Photolithography semiconductor
A Year to Remember: SK hynix Moves Further Into the Global Spotlight December 29, 2022 TECH&AI 2022 ESG Leadership SK hynix We Do Technology Year in Review
SK hynix to Showcase Energy-Efficient, High-Performance Memory Products at CES 2023 December 26, 2022 PRESS CES2023 CXL GDDR6-AiM Green Digital Solution HBM3 PIM PS1010
Improving Transparency for Global Communication: SK hynix Releases ‘Sustainability Reporting System (SRS)’ December 26, 2022 STORY ESG PRISM SRS