SK hynix Starts Mass Production of Industry’s First 24GB LPDDR5X DRAM August 11, 2023 PRESS DRAM Edge Device HKMG LPDDR LPDDR5X MassProduction OPPO
SK hynix’s LPDDR5T Verified as World’s Fastest Mobile DRAM Using MediaTek’s Next-Gen Mobile Platform August 10, 2023 TECH&AI Dimensity Platform JEDEC LPDDR5T LPDDR6 MediaTek Mobile AP SoC System-on-chip
SK hynix Showcases Samples of World’s First 321-Layer NAND August 8, 2023 PRESS 321-layer 4D NAND Flash Memory Flash Memory Summit FMS NAND TLC
SK hynix Showcases Samples of World’s First 321-Layer NAND August 8, 2023 Media 321-layer 4D NAND NAND TLC
Semiconductor Back-End Process Episode 6: The Eight Steps of Assembling Conventional Packages August 3, 2023 TECH&AI back-end process Conventional Package packages semiconductor Substrate Package
Open Communication, Creative Research, and Agile Problem-Solving: The Keys to RTC’s Advances in Semiconductor Research July 31, 2023 STORY Flip Chip Bonding Hybrid Bonding Open Research Platform ORP Package Packaging Revolutionary Technology Center RTC TSV Wire Bonding Work culture