SK hynix Ships Samples of 12-Layer Next-Gen ‘HBM4E’
June 18, 2026
MR-MUF
-
-
SK hynix unveils ‘iHBM’ thermal solution to boost AI performanceMay 26, 2026 -
[One-Team Spirit] From Early Setbacks to Global Powerhouse — SK hynix’s Journey to HBM LeadershipJune 17, 2025 -
SK hynix’s Kangwook Lee Becomes Industry’s First Packaging Executive to Win Dawon Kahng AwardFebruary 19, 2025 -
SK hynix VP Gyujei Lee Targets Continued HBM Success With Next-Gen Packaging TechnologyAugust 5, 2024 -
[Rulebreakers’ Revolutions] How MR-MUF’s Heat Control Breakthrough Elevated HBM to New HeightsJuly 30, 2024 -
Top Team Insights: “Embrace Limitless Challenges to Strengthen Advanced Packaging Tech,” Motto of P&T Head Woojin ChoiApril 11, 2024 -
SK hynix Begins Volume Production of Industry’s First HBM3EMarch 19, 2024 -
Strengthening HBM Market Leadership: Meet the SK hynix Team Behind the World’s First 12-Layer HBM3May 19, 2023 -
SK hynix Develops Industry’s First 12-Layer HBM3, Provides Samples to CustomersApril 20, 2023 -
The Value of Semiconductor Packaging Technology in the Era of Heterogeneous IntegrationFebruary 9, 2023