Strengthening HBM Market Leadership: Meet the SK hynix Team Behind the World’s First 12-Layer HBM3 May 19, 2023 TECH&AI 12-layer EMC HBM HBM3 MR-MUF
Semiconductor Back-End Process Episode 2: The Roles, Process, and Evolution of Semiconductor Packaging May 18, 2023 TECH&AI back-end process Packaging semiconductor
[We Do Future Technology] Become a Semiconductor Expert with SK hynix – UFS May 16, 2023 TECH&AI Embedded System eMMC UFS Universal Flash Storage We Do Future Technology
[DGIST Series] The Role of Semiconductor Technologies in Future Robotics May 10, 2023 TECH&AI Actuator AI DGIST Processor Robotics Sensor
[We Do Future Technology] Become a Semiconductor Expert with SK hynix – AI Semiconductors May 9, 2023 TECH&AI AI Semiconductor Computing-in-Memory ICT Alliance Neuromorphic Semiconductor SAPEON We Do Future Technology
[Tech Pathfinder] HKMG Opens the Door to Leading Mobile DRAM LPDDR5X & LPDDR5T May 3, 2023 TECH&AI DRAM HKMG LPDDR5T LPDDR5X Mobile DRAM Pathfinder
[We Do Future Technology] Become a Semiconductor Expert with SK hynix – HBM May 2, 2023 TECH&AI DRAM HBM HBM3 Memory We Do Future Technology
How Emerging Memory Supports Next-Gen Computing in the Data Explosion Era April 24, 2023 TECH&AI ACIM PCM Revolutionary Technology Center RTC SOM
[DGIST Series] How Broadband Interface Circuits Are Evolving for Optimal Data Transfer April 13, 2023 TECH&AI Broadband Data Transfer DGIST I/O Interface Interface
Semiconductor Back-End Process Episode 1: Understanding Semiconductor Testing April 6, 2023 TECH&AI back-end process semiconductor testing Wafer
[DGIST Series] How the Quest for AI Led to Next-Generation Memory & Computing Processors March 23, 2023 TECH&AI Accelerator AI Computational Memory DGIST
Korea’s First IEEE EDTM Semiconductor Conference Names Collaboration as Key to Growth March 17, 2023 TECH&AI Global Semiconductor Conference IEEE EDTM 2023 SK hynix