Beyond Clean Energy: Technology Must Help Address Data Center Challenges December 10, 2021 TECH&AI clean energy data center ESG green SK hynix
Metaverse Evolution Drives DRAM Demand and Development December 7, 2021 TECH&AI DRAM metaverse SKhynix
SK hynix’s Next – Generation CMOS Image Sensor: All 4-Coupled (A4C) Sensor November 23, 2021 TECH&AI A4C CIS CMOS
SK hynix Receives ISO 26262 FSM Certification, the International Functional Safety Standard in Automotive Semiconductors November 12, 2021 TECH&AI ADAS Automotive certification ISO safety standard
How Streaming Shows Like Squid Game Drive Semiconductor Innovation November 11, 2021 TECH&AI Datacenter HBM3 LPDDR5 OTT Streaming
The prospect of Processing In Memory (PIM) in memory systems for AI applications October 19, 2021 TECH&AI AI DRAM PIM
Cracking the Code: Leveraging AI Technology in Digital Transformation October 15, 2021 TECH&AI AI Digital Transformation DX GaussLabs
Stacking Ultra-hyper Pure Layer over Ultra-pure Wafer: Epitaxy Technology September 30, 2021 TECH&AI Epitaxy Epitaxytechnology Jong-moon Jin semiconductor
Opportunity and Challenge for Emerging Memory September 28, 2021 TECH&AI Emerging Memory FeRAM ReRAM STT-MRAM
Expert Corner: A Macro Look at Micro Technology September 17, 2021 TECH&AI integrated circuit Miniaturization Opinion Package Scaling
A New Approach to Energy Efficient Maintenance: Condition-based Maintenance September 2, 2021 TECH&AI Condition-based Maintenance Energy Harvesting Opinion Prof. Moon Smart Factory
Let’s Hit the Road: How Autonomous Vehicles are Making “10 and 2” Driving Obsolete August 26, 2021 TECH&AI ADAS Autonomous Vehicle CIS eMMC 5.1 HBM2E