The Density, Cost, and Marketing of Semiconductor Memory June 11, 2021 TECH&AI Cost Density Marketing Memory semiconductor
Let’s Hit the Road: Automated Vehicles are Pulling into the Fast Lane June 3, 2021 TECH&AI Automotive LPDDR5 NANDFlash SKhynix
Packaging Technology, a Key to Next-Generation Semiconductor Competitiveness, How Far Has SK hynix Come? June 3, 2021 TECH&AI Conventional Package FO-WLP Packaging TSV
Etching, Process to Complete Semiconductor Patterning – 2 May 25, 2021 TECH&AI Etching Jong-moon Jin patterning process
[Future Semiconductor Technologies] Next-Generation 3D Image Sensor Component- SPAD (Single-Photon Avalanche Diode) May 20, 2021 TECH&AI Dr.JoonyeonChang SPAD
A Day in the Life: Semiconductor Technology’s Impact on E-commerce May 13, 2021 TECH&AI STORY ADayintheLife E-commerce semiconductor Series Technology
The Future of CIS Technology May 13, 2021 TECH&AI CIS Future Innovation Technology HDR Image sensors Kangbong Seo ToF
Etching, Process to Complete Semiconductor Patterning – 1 May 11, 2021 TECH&AI Etching Jong-moon Jin patterning process
SK hynix holds General Shareholders Meeting Online and Offline Simultaneously to Share ‘Financial Story’ and Willingness to Increase Shareholder Value March 29, 2021 TECH&AI CEO Dividend FinancialStory GSM meeting shareholders ShareholdersMeeting
SK hynix CEO Seok-hee Lee Talks about the Future of Semiconductor Memory and SK hynix’s Management Strategy March 22, 2021 TECH&AI CEO ESG IEEE IRPS KeynoteSpeech