[One-Team Spirit] From Early Setbacks to Global Powerhouse — SK hynix’s Journey to HBM Leadership
June 17, 2025
TSV
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SK hynix Begins Volume Production of the World’s First 12-Layer HBM3ESeptember 26, 2024 -
SK hynix VP Gyujei Lee Targets Continued HBM Success With Next-Gen Packaging TechnologyAugust 5, 2024 -
Top Team Insights: “Embrace Limitless Challenges to Strengthen Advanced Packaging Tech,” Motto of P&T Head Woojin ChoiApril 11, 2024 -
New Leadership Spotlight: Vice President Hoyoung Son Targets SK hynix’s Evolution Into Total AI Memory Provider Through Advanced Packaging TechFebruary 27, 2024 -
Semiconductor Back-End Process Episode 8: Exploring the Process Stages of Different Wafer-Level PackagesOctober 5, 2023 -
The Role of Interconnection in the Evolution of Advanced Packaging TechnologyAugust 18, 2023 -
Open Communication, Creative Research, and Agile Problem-Solving: The Keys to RTC’s Advances in Semiconductor ResearchJuly 31, 2023 -
Semiconductor Back-End Process Episode 4: Understanding the Different Types of Semiconductor Packages, Part 2June 27, 2023 -
SK hynix Develops Industry’s First 12-Layer HBM3, Provides Samples to CustomersApril 20, 2023 -
Packaging Technology, a Key to Next-Generation Semiconductor Competitiveness, How Far Has SK hynix Come?June 3, 2021 -
Creating New Values in DRAM Using Through-Silicon-Via Technology for Continued Scaling in Memory System Performance and CapacityNovember 20, 2019