SK hynix’s technology roadmap for co-packaged optics features in ‘Nature Electronics,’ as AI competition shifts from chips to systems August 20, 2026 TECH&AI AI InfrastructureAI MemoryCoPackagedOpticsCPOHBMHeterogeneousIntegrationNatureElectronicsPhotonics
[Inside the Research] SK hynix’s CTI innovation advances 176-layer 3D NAND toward mass production July 22, 2026 TECH&AI 176 layer NANDCTIIEDMIEEENANDResearch InsideScaling