SK hynix Signs Preliminary Memorandum of Terms with U.S. Department of Commerce for Advanced Packaging Facility in Indiana August 6, 2024 PRESS Advanced Packaging AI Memory CHIPS and Science Act Indiana Investment Preliminary Memorandum of Terms US Department of Commerce
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana April 3, 2024 PRESS Advanced Packaging AI AI Memory HBM Indiana Investment Purdue University
