Executive Insights on SK hynix’s Top 8 Stories of 2024 December 30, 2024 TECH&AI 2024 AI Memory Executive Investment Sustainability Year in Review
SK hynix Signs Preliminary Memorandum of Terms with U.S. Department of Commerce for Advanced Packaging Facility in Indiana August 6, 2024 PRESS Advanced Packaging AI Memory CHIPS and Science Act Indiana Investment Preliminary Memorandum of Terms US Department of Commerce
SK hynix Board Approves Yongin Semiconductor Cluster Investment Plan July 26, 2024 PRESS AI Memory HBM Investment Semiconductor Fab Yongin Cluster
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana April 3, 2024 PRESS Advanced Packaging AI AI Memory HBM Indiana Investment Purdue University
A Special Purpose Company Submits an Investment Letter of Intent for a Semiconductor Cluster to Yongin February 21, 2019 PRESS Investment semiconductor
hynix Semiconductor Manufacturing America Announces $100 mil. Investment to Upgrade Eugene, Oregon Facility March 13, 2003 PRESS America Investment semiconductor
Our Position regarding the Sale of Shares in Hyundai Investment Trust Co., Ltd. July 25, 2000 PRESS Investment Sale Share
Hyundai Electronics received direct foreign investment recently June 9, 2000 PRESS foreign Investment