SK hynix Developed the World’s First Highest Density 128GB DDR4 Module April 7, 2014 PRESS 128GB DDR4 Module
hynix Develops Micro Camera Module for Mobile Handsets March 20, 2002 PRESS Camera Micro Mobile Module
hynix PC2700 DDR333 Module Validated by Leading Chipset Manufacturer, SILICON INTEGRATED SYSTEMS (SiS) October 31, 2001 PRESS DDR333 Module PC2700 SILICON INTEGRATED SYSTEMS
Hyundai Electronics Contracts with Hewlett-Packard For Exclusive Memory Module Supply February 8, 2001 PRESS Contract Memory Module
Hyundai Electronics Develops Micro Semiconductor Module for 256MB December 5, 2000 PRESS 256MB Develop Micro Module semiconductor