Technologyfeatured Semiconductor Back-End Process Episode 3: Understanding the Different Types of Semiconductor Packages In the previous episode, it was established that semiconductors require packaging for protection. These packages… June 1, 2023 user Love0
Opinionfeatured How Selector-Only Memory Emerged as the Leading Solution for CXL Since its release in 2019, Compute Express Link (CXL)1 has emerged as an efficient interconnect… May 30, 2023 user Love1
Culture & Peoplefeatured Strengthening HBM Market Leadership: Meet the SK hynix Team Behind the World’s First 12-Layer HBM3 "AI models continue to grow and drive demand for large memory capacity. We welcome the… May 19, 2023 user Love0
Technologyfeatured Semiconductor Back-End Process Episode 2: The Roles, Process, and Evolution of Semiconductor Packaging When sending fragile items in the mail, it is vital to use appropriate packaging to… May 18, 2023 user Love1
Technologyfeatured [We Do Future Technology] Become a Semiconductor Expert with SK hynix – UFS As a breakthrough generation of flash memory that has separate paths for reading and… May 16, 2023 user Love1
Technologyfeatured [DGIST Series] The Role of Semiconductor Technologies in Future Robotics Imagine relaxing in the passenger seat as your fully-autonomous vehicle drives you to work while… May 10, 2023 user Love1
Technologyfeatured [We Do Future Technology] Become a Semiconductor Expert with SK hynix – AI Semiconductors AI semiconductors are ultra-fast and low-power chips that efficiently process big data and algorithms… May 9, 2023 user Love0
Technologyfeatured [Tech Pathfinder] HKMG Opens the Door to Leading Mobile DRAM LPDDR5X & LPDDR5T From breaking barriers for performance with HBM3 to developing the world’s fastest mobile DRAM, LPDDR5T,… May 3, 2023 user Love0
