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Semiconductor Back-End Process Episode 10: Exploring the Roles of Materials in Wafer-Level Semiconductor Packaging Blog Post

Following the previous episode which covered the materials that make up conventional packages, this article will examine the various materials used in wafer-level packaging (WLP). From the resin in a…

• Opinion
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Crystalline IGZO Transistors With High Thermal Stability Show Promise for Next-Gen Memory Channels Blog Post

Amorphous InGaZnO1 (a-IGZO)-based thin-film transistors2 (TFT) have shown potential as stackable channel materials for next-generation memory solutions due to their extremely low off-current (Ioff) and high electron mobility. However, currently there is…

• Culture & People
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SK hynix Picks Up “Oscar of Innovation”: Company’s Groundbreaking KV-CSD Wins 2023 R&D 100 Award Blog Post

SK hynix won the IT/Electrical category at the 2023 R&D 100 Awards for its Key Value Computational Storage Drive (KV-CSD) Featuring the world’s first application of indexing technology, the KV-CSD…

• Culture & People
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RTC Members Reveal How Global Research Collaborations Unlock Tomorrow’s Memory Solutions Blog Post

“We need open research across borders to look beyond the present and prepare for the future. This will enable sustainable technology which pushes limitations.” The Revolutionary Technology Center (RTC), established…

• Business
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SK hynix Debuts at SC23 to Showcase Next-Gen AI & HPC Solutions Blog Post

SK hynix presented its leading AI and high-performance computing (HPC) solutions at Supercomputing 2023 (SC23) held in Denver, Colorado between November 12–17. Organized by the Association for Computing Machinery and…

• Press Release
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SK hynix Commercializes World’s Fastest Mobile DRAM LPDDR5T Blog Post

News Highlights Starts supplying 16 GB mobile DRAM package to global smartphone makers LPDDR5T to be adopted in the latest smartphones along with MediaTek Dimensity 9300 mobile processor “Company to…

• Technology
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Semiconductor Back-End Process Episode 9: Exploring the Roles of Materials in Conventional Semiconductor Packaging Blog Post

Reliability and stability are key requirements of semiconductor products to ensure their smooth operation. Semiconductor devices must therefore be protected from physical, chemical, and thermal damage by their packages, and…

• ESG
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Our ESG Progress, Visualized: How SK hynix’s Sustainability Efforts Are Building a Better World Blog Post

• Business
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Global No.1 AI Memory Solution Provider SK hynix Showcases Its 40-Year History & Road Ahead at SEDEX 2023 Blog Post

SK hynix attended SEDEX 2023 as a leader in AI memory Commemorating its 40th anniversary, SK hynix showcased its history and tenacity Company’s display of next-gen AI solutions such as…

• Opinion
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3D Fe-NAND to Surpass 3D CTN Memory Following Cell Stacking Breakthrough Blog Post

Conventional 3D NAND memory stores data by trapping charges in the silicon nitride film known as a charge trade nitride (CTN) layer. Despite its widespread use, 3D CTN NAND faces…

• Business
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[Brand Video] Who Are the Rulebreakers? Blog Post

Galileo. Picasso. The Wright Brothers. Throughout history, innovation in everything from astronomy and art to technology, engineering and beyond has been brought about by rulebreakers. At a time when the…

• Press Release
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SK hynix Reports Third Quarter 2023 Financial Results Blog Post

Technical prowess, competitive products help expand revenues, narrow operating losses DRAM turns around from two quarters of losses, helped by brisk sales of premium products “Company to open up new…