SK hynix Showcases AI-Driven Innovations for a Sustainable Tomorrow at CES 2025

SK hynix has returned to Las Vegas for Consumer Electronics Show (CES) 2025, showcasing its latest AI memory innovations reshaping the industry. Held from January 7–10, CES 2025 brings together the brightest minds and groundbreaking technologies from the world’s leading tech companies.

This year, the event’s theme is “Dive In,” inviting attendees to immerse themselves in the next wave of technological advancement. SK hynix is emphasizing how it is driving this wave through a display of leading AI memory technologies at the SK Group exhibit. Along with SK Telecom, SKC, and SK Enmove, the company is highlighting how the Group’s AI infrastructure brings about true change under the theme “Innovative AI, Sustainable Tomorrow.”

Groundbreaking Memory Tech Driving Change in the AI Era

SK hynix is underlining its AI memory leadership at CES 2025

Visitors enter SK Group’s exhibit through the Innovation Gate, greeted by a video of dynamic wave-inspired visuals which symbolize the power of AI. The video shows the transformation of binary data into a wave which flows through the exhibition, highlighting how data and AI drives change across industries.

Continuing deeper into the exhibit, attendees make their way into the AI Data Center area, the focal point of SK hynix’s display. This area features the company’s transformative memory products driving progress in the AI era. Among the cutting-edge AI memory technologies on display are SK hynix’s HBM¹, server DRAM, eSSD, CXL®², and PIM³ products.

¹High Bandwidth Memory (HBM): A high-performance memory that vertically stacks multiple DRAM chips with through-silicon via (TSV). HBM3E is the extended version of HBM3, the fourth generation following HBM, HBM2, and HBM2E.
²Compute Express Link® (CXL®): A next-generation interface that connects the CPU, GPU, memory, and other components to efficiently enhance the performance of high-performance computing systems.
³Processing-In-Memory (PIM): A next-generation technology that integrates computational capabilities into memory, addressing data movement bottlenecks in AI and big data processing.

The 48 GB 16-layer HBM3E takes center stage at the AI Data Center area

A sample of the company’s pioneering 16-layer HBM3E is prominently showcased at the event, highlighting SK hynix’s leadership in the HBM field. As the world’s largest capacity HBM, the 48 GB 16-layer HBM3E, which is currently under development, is optimized for AI learning and inference. Visitors can also check out DDR5 RDIMM and MCR DIMM, high-speed server DRAM modules tailored for data center environments which offer rapid data processing and large memory capacity.

SK hynix’s cutting-edge AI memory technologies on display

As data storage becomes ever more crucial in the AI landscape, SK hynix is also showcasing its eSSD (enterprise SSD) solutions, including PS1010, PEB110, and PE9010. Designed for data centers, these products offer the reliability and rapid read/write speeds needed to handle the immense data generated by AI applications. Additionally, SK hynix is presenting its groundbreaking CXL technologies, such as CMM-DDR5⁴ and CMM-Ax⁵, which are pushing the boundaries of memory interfaces for enhanced flexibility and scalability in AI systems. Also on display are PIM solutions including GDDR6-AiM and AiMX⁶, a high-speed, low-power accelerator card which performs computational functions, revolutionizing data processing efficiency in AI environments.

⁴CXL Memory Module-DDR5 (CMM-DDR5): A next-generation DDR5 memory module utilizing CXL technology to boost bandwidth and performance for AI, cloud, and high-performance computing.
⁵CXL Memory Module-Ax (CMM-Ax): A high-performance memory module optimized for computational workloads, improving AI and data center efficiency.
⁶Accelerator-in-Memory Based Accelerator (AiMX): SK hynix’s specialized accelerator card tailored for large language model processing using GDDR6-AiM chips.

Visitors can also check out the company’s innovative on-device AI solutions

SK hynix is also showcasing its on-device AI solutions⁷ to highlight the AI service applications of its products. These include LPCAMM2⁸, the mobile NAND solution ZUFS⁹ 4.0, and PCB01—the industry’s highest-performing SSD for on-device AI PCs. Through these displays, SK hynix is underlining how these technologies deliver top performance with power efficiency, empowering a range of applications from mobile AI to consumer electronics.

⁷On-device AI: A technology that enables real-time AI processing directly on devices, enhancing responsiveness and delivering personalized services without relying on cloud-based computation.
⁸Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that offers power efficiency and high performance as well as space savings. It offers performance levels equivalent to two DDR5 SODIMMs, making it optimized for on-device AI.
⁹Zoned Universal Flash Storage (ZUFS): An advanced version of UFS that improves data management efficiency by organizing data into zones, optimizing transfer between the operating system and storage device.

A Pioneer for a Sustainable Future

As CES 2025 unfolds, SK hynix’s presence once again cements its position as a leader in AI memory solutions. Through its innovative products and visionary approach, the company is demonstrating the essential role memory plays in the growing AI ecosystem. At CES 2025, SK hynix is not just showcasing products, but also offering a glimpse into a future where AI drives sustainable progress across industries. Looking ahead, CEO Kwak Noh-Jung shared the company’s vision. “Driven by constant technological innovation and a robust product lineup tailored for the AI era, SK hynix is on track to becoming a full stack AI solution provider,” he said.