SK hynix Showcases AI Memory Leadership & Shares Future Vision at SEDEX 2024

SK hynix is showcasing its next-generation memory technology and vision for the AI era at the Semiconductor Exhibition (SEDEX) 2024 held at COEX in Seoul, South Korea, from October 23–25.

Organized by the Korea Semiconductor Industry Association, SEDEX is South Korea’s largest semiconductor exhibition. This year’s event, the 26^th edition of the exhibition, is themed “The Integration of AI Semiconductors and Cutting-Edge Packaging Technology.” Featuring 600 booths, it brings together 250 companies representing the entire semiconductor ecosystem, including semiconductor devices, system semiconductors, equipment and components, materials, facilities, and sensors.

Visitors to SK hynix’s exhibition explore the company’s advanced products

 

Under the slogan of “Memory, The Heart of AI,” SK hynix is presenting advanced technologies which are driving AI innovation and underlining its AI memory leadership. These include its industry-leading HBM¹, CXL^®2, the next-generation AI memory solution, and PIM³, the next-generation intelligent memory. Additionally, it features server products for high-performance computing in data centers and on-device AI⁴ solutions for smart devices.

¹High Bandwidth Memory (HBM): A high-performance, high-value memory that achieves high bandwidth by connecting multiple DRAM chips using through-silicon via (TSV). This memory significantly boosts data processing speeds compared to traditional DRAM.
²Compute Express Link^® (CXL^®): A next-generation interface designed to efficiently utilize high-performance computing systems by connecting CPU, GPU, memory, and other components.
³Processing-In-Memory (PIM): A technology which enhances memory performance through its processing capabilities, helping to address data transfer bottlenecks in AI and big data applications.
⁴On-Device AI: A technology that enables AI processing directly on the device, improving responsiveness and delivering personalized, real-time services without the need for cloud-based computation.

SK hynix is also sharing its new vision through its 41st anniversary brand film and the Yongin Semiconductor Cluster exhibition as the company looks to leverage 40 years of expertise to strengthen its position as the global no. 1 AI memory provider.

As well as technological innovations, SK hynix is promoting its social value (SV) initiatives such as the Happy Bread bakery project. This initiative is run by Happy Moa, an SK hynix subsidiary that aims to increase employment opportunities for the disabled. The SV zone features various attractions for visitors, including interactive games and exhibits.

During the three-day event, SK hynix also delivered a keynote address on the key role of packaging for AI technologies. To shed light on SK hynix’s activities at SEDEX 2024, the newsroom visited the company’s booth, capturing its technological vision as a total AI memory provider.

Showcasing Global No. 1 AI Memory Technology: From HBM to Server & On-Device AI Solutions

A simulation of virtual GPUs powered by HBM3E

 

At the center of the exhibition hall, SK hynix has set up a large LED wall that immerses visitors in a virtual AI data center. The wall includes simulations of virtual GPUs powered by the industry-leading HBM3E, offering a realistic experience of an operational data center. Behind it, an exhibition space highlights SK hynix’s flagship AI memory products.

The HBM exhibition zone features a display of the 12-layer HBM3E and a rice-based art installation to highlight the product’s capacity

 

The main product at the center of the exhibition is HBM, the highest-performing DRAM for AI workloads. On display is the world’s first 12-layer HBM3E, which SK hynix began mass producing in September 2024. A standout feature of the HBM exhibit, which covers the developmental history of the product, is an art installation illustrating the high capacity of the 12-layer HBM3E compared with the world’s first DRAM from 1970. It uses grains of rice to visually convey the dramatic leap in memory technology driven by SK hynix’s technological prowess.

To the left of the HBM exhibition zone, a dedicated space is showcasing next-generation AI memory technologies including PIM and CXL.

The PIM zone features AiM and AiMX products

 

The PIM section introduces SK hynix’s AiM⁵ product and the AiMX accelerator card. Combining multiple GDDR6-AiM chips, AiMX is a high-speed, low-power, cost-effective memory solution which can perform computational functions—making it optimized for generative AI applications.

⁵Accelerator-in-Memory (AiM): SK hynix’s PIM semiconductor product, which features the GDDR6-AiM.

CMM-DDR5 and CMM-Ax are on display in the CXL zone

 

In the CXL section, SK hynix is presenting its CMM (CXL Memory Module)-DDR5⁶ which expands system bandwidth by up to 50% and capacity by up to 100% compared to systems equipped with only DDR5. A sample of CMM-Ax⁷, which integrates machine learning and data filtering functions into CXL memory, is also on display. A live demonstration of a system equipped with CMM-Ax highlights its exceptional performance.

⁶CXL Memory Module-DDR5 (CMM-DDR5): A next-gen DDR5 memory module based on CXL that enhances system bandwidth, speed, and performance for AI, cloud, and high-performance computing.
⁷CXL Memory Module-Ax (CMM-Ax): A high-performance memory module optimized for computational workloads, improving AI and data center efficiency.

To the right of the HBM exhibition, SK hynix is displaying AI solutions for servers and on-device applications.

AI solutions for servers, including DDR5 RDIMM, are also being showcased

 

These include products gaining attention in the high-performance computing (HPC) market such as the world’s first 1cnm DDR5 RDIMM and DDR5 MCR DIMM. The DDR5 products are showcased alongside a lineup of enterprise SSDs (eSSDs) compatible with various server form factors.

The 1cnm DDR5 RDIMM, first revealed at the TSMC Open Innovation Platform (OIP) Ecosystem Forum in September 2024, offers 11% faster operating speeds and over 9% improved power efficiency compared to the previous generation. When applied to data centers, the product is expected to reduce operational costs by up to 30%.

The on-device AI exhibition includes key products such as LPCAMM2 and ZUFS 4.0

 

In the on-device AI solution section, SK hynix is displaying LPCAMM2, which packages LPDDR5X⁸, and the next-generation mobile NAND solution, ZUFS 4.0⁹. LPCAMM2 provides the performance of two SODIMM¹⁰ DRAM modules in a single package, offering space savings, lower power consumption, and high performance—ideal for on-device AI applications. As the highest-performing product in the industry, ZUFS 4.0 enhances smartphone application launch speeds by approximately 45% over previous versions in long-term usage environments, making it an optimal solution for on-device AI in mobile devices.

In addition to these innovative displays, SK hynix shared its industry expertise through a keynote address by Kangwook Lee, head of Package Development. Held on the second day of the event, Lee’s presentation covered the role of advanced packaging in the AI era.

⁸Low Power Double Data Rate 5X (LPDDR5X): A low-voltage DRAM standard for mobile devices like smartphones and tablets, designed to reduce power consumption.
⁹Zoned Universal Flash Storage (ZUFS): An advanced version of UFS that improves data management efficiency by organizing data into zones, optimizing transfer between the operating system and storage device.
¹⁰Small Outline DIMM (SODIMM): A compact memory module typically used in laptops and desktop PCs.

Sharing a Vision for the Future of the AI Era

A special exhibit introducing the Yongin Semiconductor Cluster and SK hynix’s industrial AI start-up, Gauss Labs

 

Aside from the main exhibition area, SK hynix is presenting a special exhibit highlighting the Yongin Semiconductor Cluster and its industrial AI start-up, Gauss Labs.

The Yongin Semiconductor Cluster is currently undergoing development in the South Korean city of Yongin. During the exhibition, SK hynix is sharing the goals and vision of the cluster, which aims to become a hub for the AI memory ecosystem and a key component of the company’s long-term growth strategy.

(From left) The Tube T31 and Beetle X31 are shown at the Brand SSD zone

 

A separate exhibition zone is also being dedicated to brand SSDs, a type of B2C product aimed at general consumers. This zone includes a U.S. promotional video for the portable Beetle X31 SSD,  along with displays of the PCIe SSDs Platinum P41 and P51, as well as the stick-type SSD Tube T31.

A selection of breads prepared by the Happy Bread bakery

 

The company is also introducing its social value initiative, the Happy Bread bakery. As the bakery brand of Happy Moa under SK hynix, it employs approximately 190 individuals with developmental disabilities with customized jobs across various baking processes. Visitors to the booth can enjoy breads and cookies made by the Happy Bread bakery.

Visitors enjoying taking part in a quiz and playing various games organized by SK hynix

 

In addition to these activities, SK hynix is engaging visitors through a variety of events and games throughout the exhibition hall. At the entrance of the Brand SSD zone, an interactive “Find the Beetle X31” game highlights the performance of the portable SSD. A dedicated gaming zone is also centered around the company’s memory innovations where visitors can play jumping games, pinball, and layer stacking games. This area also features interactive activities such as a quiz and a raffle with attractive prizes.

At SEDEX 2024, SK hynix is underscoring the critical role of its memory solutions in the AI era. By showcasing its diverse portfolio of cutting-edge products and technologies in one place, SK hynix is solidifying its position as a total AI memory provider.