#AI Memory#CXL#DRAM#eSSD#HBM3E#HBM4#NAND

SK hynix_Semiconductor Back-End Episode 8_Image 03

September 19, 2023

The steps for forming a flip chip bump which includes a flip chip with I/O final metal pad and dielectric layer, sputtering showing the sputtered seed layer, photoresist patterning, electroplating, PR strip and metal etching, and solder reflow.

Submit a Comment

Your email address will not be published. Required fields are marked *

Tag

Related Posts