SK hynix_Semiconductor Back-End Episode 8_Image 06

The steps of the TSV packaging process including silicon etching, TSV copper filling, TSV copper CMP, BEOL metallization with aluminum pad opening, frontside bump formation, wafer solder reflow, temporary carrier bonding, TSV exposure and backside passivation, passivation CMP and TSV copper exposure, backside bump formation, carrier wafer debonding and thin wafer mounting on tape, and chip stacking and package assembly with overmold.

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