Technologyfeatured Semiconductor Back-End Process Episode 11: Reliability Tests and Standards for Semiconductor Packages This series has examined the semiconductor back-end process in detail, covering everything from the different… December 20, 2023 user Love1
Technologyfeatured [Tech Pathfinder] How SK hynix’s Advanced 4D NAND Technologies Are Overcoming Stacking Limitations At the Flash Memory Summit (FMS) 2023 in August, SK hynix unveiled samples of the… December 19, 2023 user Love0
ESGfeatured Innovative Minds, Sustainable Solutions: The Journey of Recycling CMP Pads Consumable materials essential for semiconductor production such as wafers, slurries1, and pads are disposed of… December 12, 2023 user Love2
Technologyfeatured Semiconductor Back-End Process Episode 10: Exploring the Roles of Materials in Wafer-Level Semiconductor Packaging Following the previous episode which covered the materials that make up conventional packages, this article… December 11, 2023 user Love1
Opinionfeatured Crystalline IGZO Transistors With High Thermal Stability Show Promise for Next-Gen Memory Channels Amorphous InGaZnO1 (a-IGZO)-based thin-film transistors2 (TFT) have shown potential as stackable channel materials for next-generation memory solutions… November 30, 2023 user Love1
Culture & Peoplefeatured SK hynix Picks Up “Oscar of Innovation”: Company’s Groundbreaking KV-CSD Wins 2023 R&D 100 Award SK hynix won the IT/Electrical category at the 2023 R&D 100 Awards for its Key… November 29, 2023 user Love0
Culture & Peoplefeatured RTC Members Reveal How Global Research Collaborations Unlock Tomorrow’s Memory Solutions "We need open research across borders to look beyond the present and prepare for the… November 28, 2023 user Love0
Technologyfeatured Semiconductor Back-End Process Episode 9: Exploring the Roles of Materials in Conventional Semiconductor Packaging Reliability and stability are key requirements of semiconductor products to ensure their smooth operation. Semiconductor… November 2, 2023 user Love1
ESGfeatured Our ESG Progress, Visualized: How SK hynix’s Sustainability Efforts Are Building a Better World November 1, 2023 user Love2
Opinionfeatured 3D Fe-NAND to Surpass 3D CTN Memory Following Cell Stacking Breakthrough Conventional 3D NAND memory stores data by trapping charges in the silicon nitride film known… October 31, 2023 user Love1
