SK hynix Debuts at SC23 to Showcase Next-Gen AI & HPC Solutions November 20, 2023 TECH&AI AiMX CXL eSSD HBM3E High-performance computing OCS SC23 Supercomputing 2023
SK hynix Commercializes World’s Fastest Mobile DRAM LPDDR5T November 13, 2023 PRESS DRAM LPDDR5T MediaTek Mobile AP
Semiconductor Back-End Process Episode 9: Exploring the Roles of Materials in Conventional Semiconductor Packaging November 2, 2023 TECH&AI back-end process Conventional Packaging packaging materials primary materials semiconductor subsidiary materials
Our ESG Progress, Visualized: How SK hynix’s Sustainability Efforts Are Building a Better World November 1, 2023 STORY ESG PRISM SK hynix Social Sustainability Efforts Sustainability Report
Global No.1 AI Memory Solution Provider SK hynix Showcases Its 40-Year History & Road Ahead at SEDEX 2023 November 1, 2023 TECH&AI 40th Anniversary AI Memory AiMX HBM3E SEDEX We Do Technology
3D Fe-NAND to Surpass 3D CTN Memory Following Cell Stacking Breakthrough October 31, 2023 TECH&AI 3D CTN Memory 3D Fe-NAND QLC Revolutionary Technology Center RTC
[Brand Video] Who Are the Rulebreakers? October 30, 2023 TECH&AI Brand Video Rulebreakers SK hynix WeDoTechnology
SK hynix Reports Third Quarter 2023 Financial Results October 25, 2023 PRESS IR Earnings Quarterly Earnings Third Quarter 2023
SK hynix’s LPDDR5T, World’s Fastest Mobile DRAM, Completes Compatibility Validation with Qualcomm October 25, 2023 PRESS AP Application Processor high-k metal gate HKMG LPDDR5T Qualcomm RAM
Enabling Nanoscale Device Fabrication Through Area-Selective Atomic Layer Deposition October 23, 2023 TECH&AI ALD AS-ALD precursor Scaling
SK hynix Displays Next-Gen Solutions Set to Unlock AI & More at OCP Global Summit 2023 October 20, 2023 TECH&AI AiM Computer Memory Solution CXL eSSD GDDR6-AiM Generative AI HBM LPDDR CAMM OCP Global Summit Open Computer Project PCIe Gen5
Q3 2023 Earnings Conference Call Invitation October 12, 2023 PRESS IR Invitation Letter Quarterly Earnings