SK hynix Debuts Prototype of First GDDR6-AiM Accelerator Card ‘AiMX’ for Generative AI September 18, 2023 TECH&AI AI Hardware & Edge AI Summit AiMX GDDR6-AiM Generative AI accelerator PIM
SK Group Chairman Says Yongin Cluster to Make History as Platform for Semiconductor Challenges & Innovation September 15, 2023 PRESS Semiconductor Fab SK hynix Yongin Cluster
SK hynix’s DDR5 Key to Enabling Industry-Leading Performing Data Centers, White Paper Reveals September 14, 2023 TECH&AI 4th Gen Xeon 4th Generation Xeon data center DDR5 DRAM Intel Intel® Xeon® Scalable Processors LPDDR5X SK hynix white paper Xeon
Our ESG Progress, Visualized: SK hynix’s Innovations for a Greener Environment September 11, 2023 STORY Environment ESG PRISM SK hynix Sustainability Report
Semiconductor Back-End Process Episode 7: The Wafer-Level Packaging Process September 4, 2023 TECH&AI back-end process electroplating metal etching Photolithography photoresist stripping semiconductor sputtering wafer-level package
[DGIST Series] Sensor Interfaces and ADC Circuits: Bridging the Physical and Digital Worlds August 25, 2023 TECH&AI ADC AFE DGIST SAR Sensor Interface
SK hynix Develops World’s Best Performing HBM3E, Provides Samples to Customer for Performance Evaluation August 21, 2023 PRESS AI application DRAM HBM HBM3E SK hynix
The Role of Interconnection in the Evolution of Advanced Packaging Technology August 18, 2023 TECH&AI Flip Chip Bonding Hybrid Bonding Package Packaging TSV Wire Bonding
FMS 2023: SK hynix Showcases World’s First 321-Layer NAND Samples & Storage Solutions August 16, 2023 TECH&AI 321-layer 4D NAND Automobile Flash Memory Flash Memory Summit FMS FMS2023 KV-CSD Mobile PCIe PCIe Gen5 UFS
SK hynix Starts Mass Production of Industry’s First 24GB LPDDR5X DRAM August 11, 2023 PRESS DRAM Edge Device HKMG LPDDR LPDDR5X MassProduction OPPO
SK hynix’s LPDDR5T Verified as World’s Fastest Mobile DRAM Using MediaTek’s Next-Gen Mobile Platform August 10, 2023 TECH&AI Dimensity Platform JEDEC LPDDR5T LPDDR6 MediaTek Mobile AP SoC System-on-chip
SK hynix Showcases Samples of World’s First 321-Layer NAND August 8, 2023 PRESS 321-layer 4D NAND Flash Memory Flash Memory Summit FMS NAND TLC