SK hynix Obtains AAA Ratings, Highest Level of Certification for Voluntary Compliance Trader from South Korea’s Trade Ministry July 5, 2023 PRESS Compliance Exports MOTIE SK hynix strategic assets
Semiconductor Back-End Process Episode 4: Understanding the Different Types of Semiconductor Packages, Part 2 June 27, 2023 TECH&AI back-end process Chip stacks Package stacks packages semiconductor SiP TSV
SK hynix Showcases Data Center Memory Solutions at HPE Discover 2023 June 23, 2023 TECH&AI CXL HBM3 HPE PIM SEMICONDUCTOR MEMORY
SK hynix Beetle X31: SK hynix Launches its First Portable SSD for Consumer Market June 21, 2023 TECH&AI Beetle consumer SSD pSSD SSD X31
SK hynix Receives International Certification for Automotive Memory Solution Development June 20, 2023 PRESS ASPICE Automotive memory solution NAND SK hynix SSD UFS
[DGIST Series] The Technologies Handling the Growing Data Demands in Healthcare June 16, 2023 TECH&AI 3D ultrasound imaging AI DGIST Healthcare Medical AI Point-of-care
SK hynix Generates 7.6T Won in Social Value in 2022 June 12, 2023 PRESS DBL ESG SK hynix Social Value Sustainability SV
SK hynix Begins Mass Production of Industry’s Highest 238-Layer 4D NAND June 8, 2023 PRESS 238-layer 4D NAND Flash Memory
Semiconductor Back-End Process Episode 3: Understanding the Different Types of Semiconductor Packages June 1, 2023 TECH&AI back-end process conventional packages packages semiconductor wafer-level packages
How Selector-Only Memory Emerged as the Leading Solution for CXL May 30, 2023 TECH&AI CXL IEDM 2022 Revolutionary Technology Center RTC SOM SSM
SK hynix Enters Industry’s First Compatibility Validation Process for 1bnm DDR5 Server DRAM May 30, 2023 PRESS DDR5 HKMG Intel LPDDR5T
SK hynix Showcases Its Next-Generation Technologies at Dell Technologies World 2023 May 25, 2023 TECH&AI CXL Dell Technologies World DTW 2023 HBM3 PC801 PS1010 SK hynix Solidigm TeamSK