SK hynix Reports First Quarter 2023 Financial Results April 26, 2023 PRESS IR Earnings First Quarter 2023 Quarterly Earnings
SK hynix Develops Industry’s First 12-Layer HBM3, Provides Samples to Customers April 20, 2023 PRESS 12-layer HBM3 MR-MUF TSV
Q1 2023 Earnings Conference Call Invitation April 12, 2023 PRESS IR Invitation Letter Quarterly Earnings
SK hynix Reports 2022 and Fourth Quarter Financial Results January 31, 2023 PRESS IR Earnings Fiscal Year 2022 Fourth Quarter 2022 Quarterly Earnings
SK hynix Develops World’s Fastest Mobile DRAM LPDDR5T January 24, 2023 PRESS DRAM LPDDR5T semiconductor
Q4 2022 Earnings Conference Call Invitation January 18, 2023 PRESS IR Invitation Letter Quarterly Earnings
SK hynix Obtains Industry’s First Validation for 1anm DDR5 DRAM on the 4th Gen Intel® Xeon® Scalable Processor January 12, 2023 PRESS DDR5 DRAM Intel SK hynix Xeon
SK hynix Issues Industry’s First Sustainability-Linked Bond January 10, 2023 PRESS ESG Green Bond SLB Social Value Sustainability-Linked Bond
SK hynix’s Vice Chairman Park Jung-ho Meets with Qualcomm CEO at CES 2023 for Greater Collaboration in Semiconductor Business January 5, 2023 PRESS DDR5 HBM3 Partnership Qualcomm SK hynix
SK hynix to Showcase Energy-Efficient, High-Performance Memory Products at CES 2023 December 26, 2022 PRESS CES2023 CXL GDDR6-AiM Green Digital Solution HBM3 PIM PS1010
SK hynix Develops MCR DIMM – World’s Fastest Server Memory Module December 8, 2022 PRESS DDR5 DRAM MCR DIMM
SK hynix Becomes Founding Member of SCC, Joining Semiconductor Industry’s Efforts to Combat Climate Change November 7, 2022 PRESS ESG Net Zero SCC Semiconductor Climate Consortium Sustainability