Press Release

hynix and M-Systems to Offer a New Generation of DiskOnChip Embedded Flash Drives for Use in Mobile Handsets and Consumer Electronics Devices

By January 5, 2006 December 9th, 2019 No Comments
– DOC H3, the companies’ first jointly introduced product, will utilize the latest NAND flash from hynix and M-Systems’ built-in TrueFFS flash management software

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SEOUL and SUNNYVALE, Calif., Jan. 4, 2006

hynix Semiconductor Inc. (KSE: 000660.KS) , one of the world’s leading memory semiconductor manufacturers, and M-Systems (Nasdaq: FLSH), an industry leader and innovator of flash-based data storage devices, today announced plans to offer their first-ever jointly introduced DiskOnChip (DOC) embedded flash drive (EFD) – DOC H3, based on the field-proven DiskOnChip architecture.

DOC H3 is designed to be a self-contained EFD with M-Systems’ TrueFFS flash management software running internally as firmware from within the flash controller inside the chip. This architecture is designed to minimize overall system integration complexity and help reduce end-product design cycles by offering mobile handset and consumer electronics device manufacturers a virtually plug-and-play EFD. “We are truly excited to announce the first jointly introduced fruit of our recently established partnership with hynix, a world leader in memory technology.

hynix’s adoption of DOC H3 sends a strong endorsement signal to the industry on behalf of our DiskOnChip architecture and is definitely exciting news for mobile handset and consumer electronics device manufacturers,” said Dov Moran, president and CEO of M-Systems. “This new collaboration also represents a first embodiment of our firm commitment to providing our customers with multiple sources for DiskOnChip architecture-based EFDs.

As a result of this joint development effort, our customers will now have the assurance and peace of mind of having an additional, reliable and robust source for easy-to-integrate, high-density, quality EFDs containing the optimum flash technology from hynix. We at M-Systems certainly look forward to the continuation of this very promising collaboration with hynix.” “We are very pleased to announce our first jointly introduced product with M-Systems.DOC H3 provides us with the ability to expand our product offering for the mobile handset and consumer electronics devices markets,” said C.S. Oh, COO of hynix. “By combining our latest flash technology with M-Systems’ advanced technology, we can now offer our customers an immediate path to the benefits of our most advanced technology and cost competitive solution. We at hynix anticipate this fruitful partnership to yield many more such jointly developed products in the future.”

Engineering samples of DOC H3 will be available in the first quarter of 2006, with availability for mass production planned for the second quarter. It will be available in densities of 128 megabytes (1Gbit) to 2 gigabytes (16Gbit), in 9×12 and 12×18 FBGA packages and will have the capability to work in 1.8V and 3.3V.