SEOUL, South Korea, Nov. 15, 2005
hynix Semiconductor, Inc. today announced the availability of DRAM industry’s first JEDEC standard 8GB DDR2 registered dual in-line memory modules (R-DIMMs) by utilizing hynix’s own multi-die stacking technology.
hynix has begun sampling the 8GB DDR2 R-DIMMs for high-end server applications. The new modules consist of 36 2Gb dual die package (DDP) devices and a total of 72 die by utilizing hynix’s own multi-die stacking technology. The hynix 2Gb DDP devices utilize two 1Gb DDR2 SDRAM die based on the company’s .10-micron process technology in one package. hynix’s new DDR2 R-DIMMs can fully meet the JEDEC standard of 30.35mm module width and 133.35 mm height, maximizing memory capacity to 8GB. Currently, other 8GB DDR2 R-DIMMs already available in the market place are extended-size Tall-DIMMs.
The development of the JEDEC standard 8GB DDR2 R-DIMM by hynix demonstrates the company’s leading technical expertise and strong competitiveness in the server market. hynix is expected to further enhance its keen focus on delivering high-quality, reliable solutions to customers by committing to research and development on higher-density and smaller-form memory modules.
About hynix Semiconductor Inc.
hynix Semiconductor Inc. (HSI) of Icheon, Korea, is a leading supplier of semiconductor memory products such as Dynamic Random Access Memory chips (“DRAMs”), Static Random Access Memory chips (“SRAMs”) and Flash memory chips to a wide range of customers. The Company’s shares are traded on the Korea Stock Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about hynix is available at www.hynix.com.
