– To lead global ‘Smart Mobile Solution’ market
Seoul – February 27, 2012
hynix Semiconductor Inc. (‘hynix’ or ‘the company’, www.hynix.com) introduces ‘Smart Mobile Solution’ products at Mobile World Congress (‘MWC’) 2012 in Barcelona, Spain. Hynix participates in this world’s largest exhibition for the mobile industry with SK Telecom and this is the first ever display.
The concept of the hynix’s exhibition is ‘hynix enabling a ubiquitous world’. The company introduces a various series of mobile solutions including 20nm class 4Gigabit (‘Gb’) DDR3 DRAM and 30nm class 4Gb LPDDR3 DRAM. It also sees a possibility of growth in the new market such as smart car by introducing ‘Infotainment’ products which are developed after a yearlong collaboration with NVIDIA.
Display the next generation products for smart mobile solutions
▲ 20nm Class 4Gb DDR3 DRAM
The newly developed 20nm class 4Gb DDR3 DRAM is targeting high density applications such as high-end virtualized servers, datacenter servers and high performance Tablet and Ultrabooks. This product meets the JEDEC standard.
The product offers maximum data transfer speed of 2133Mbps (Megabits per second) or 4.3 GB/s (Gigabytes per second) bandwidth with a 16-bit I/O, supporting the ultra low voltage operation of 1.25V. It saves more than 40% power consumption than the existing 30nm class products. In terms of production efficiency, it is increased by more than 60% over the 30nm class process technology.
According to a market research firm, iSuppli, demand for 2Gb DDR3 is expected to gradually decline after a peak in this year with 78% of bit shipments while 4Gb DDR3 is expected to become a mainstream. hynix plans to start volume production of the new 20nm class 4Gb DDR3 DRAM in the first half of 2012. High density of 64Gigabyte (‘GB’) modules for the cloud computing market will be also added to our portfolios.
▲ 30nm Class 4Gb LPDDR3 DRAM
The company also introduced newly produced 30nm class 4Gb LPDDR3 DRAM which are customized for the high-end smartphone, Tablet and Ultrabooks. This product provides MCP (Multi Chip Package) and PoP (Package on Package) platforms. hynix meets customer needs with its 8Gb (1GB) and 16Gb (2GB) density products which contain two layers and four layers respectively. It boasts maximum operating speed of 1,600Mbps at 1.2V power supply, and processes up to not only 6.4GBps with a 32-bit I/O, but also 12.8GBps with dual channel configuration. While this product not only maintains the same standby power consumption with LPDDR2, it also provides high speed operation up to 50% of improvement which enables to support low power and high performance solutions. With its great performances, the product which meets almost all the JEDEC standard specifications, are well suited for mobile applications.
According to the iSuppli, due to increasing requirement of high performance mobile DRAM, the demand for LPDDR3 is expected to increase up to 56% in 2015 and LPDDR3 as a mobile DRAM will become the mainstream.
“hynix has a variety of mobile products which satisfy requirements of high density, high performance and low power consumption.”, said Mr. Ji-Bum Kim, Chief Marketing Officer of hynix. “hynix is able to provide competitive solutions to the mobile application market.”, he added.
hynix also introduced other mobile solutions including SSD (Solid State Drive) with density of 128GB~512GB and CIS (CMOS Image Sensor) as well.
Enter the infotainment memory semiconductor market
Another items including 30nm class 4Gb DDR3 consumer DRAM and eMMC (Embedded Multi Media Card or ‘e-NAND’ of hynix brand) NAND Flash are exhibited. Collaborating with NVIDIA, hynix entered the infotainment memory semiconductor market. At CES2012 held in last January, several prestigious Germany automobile all equipped with hynix memory were introduced.
The infotainment system, which integrates navigation, Internet, video, and location based services, is an evolution from the single function navigation systems currently installed in automobile. The automobile industry sees major growth opportunities in smart cars with infotainment systems over the next few years. This automobile semiconductor market is especially difficult to enter since it requires higher reliability, quality condition and longer qualification process which takes more than a year.
hynix expects this participation to this MWC will boost its business scope to the smart mobile solution market and strengthen relationship with related customers. Through cooperation with SK Telecom, the Korea’s number one mobile carrier, hynix will enlarge the business area and have closer access to the mobile market trends and developments. Both companies will continuously seek global business opportunities which are creating a synergy by combining together.
About hynix Semiconductor Inc.
hynix Semiconductor Inc. (HSI) of Icheon, Korea, is the world’s top tier memory semiconductor supplier offering Dynamic Random Access Memory chips (“DRAMs”) , Flash memory chips (“NAND Flash”) and CMOS Image Sensor (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about hynix is available at www.hynix.com.
Media Contact
SK hynix Inc.
Corporate Communications
Senior Manager
Seong-Ae Park
Phone: +82.2.3459.5325
Fax: +82.2.3459.5333
E-Mail: seongae.park@sk.com
