SK hynix Indiana fab breaks ground as new hub for US AI innovation August 28, 2026 STORY AI Infra AI Memory HBM Indiana fab
SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI” August 28, 2026 PRESS Advanced Packaging AI Memory HBM Indiana plant
[LIVE] SK hynix Indiana Fab Groundbreaking Ceremony August 27, 2026 STORY AI AI Memory semiconductor industry
SK hynix Presents a Full Lineup of Memory Solutions Optimized for AI Infrastructure at DTF 2026 August 26, 2026 TECH&AI AI Memory cSSD DellTechForum DRAM DTF eSSD HBM NAND
[Tech Note] Hybrid Bonding: Evolving into a Foundational Technology for Improving Semiconductor Performance August 25, 2026 TECH&AI Advanced Packaging back-end process HBM HBM4 Hybrid Bonding Packaging
SK hynix’s technology roadmap for co-packaged optics features in ‘Nature Electronics,’ as AI competition shifts from chips to systems August 20, 2026 TECH&AI AI Infrastructure AI Memory CoPackagedOptics CPO HBM HeterogeneousIntegration NatureElectronics Photonics
SK hynix Accelerates 40 Trillion won Share Repurchase and Cancellation Program, Pursues Shareholder Return Expansion to ‘Over 50% of FCF’ August 19, 2026 PRESS IR IR semiconductor industry Shareholder return
[AI Ecosystem] The paradigm shift in AI computing August 18, 2026 TECH&AI Agentic AI AI Infrastructure AI Memory semiconductor industry
[Analyst Interview | Ryu Hyung-keun, Daishin Securities] Exploring SK hynix’s Next Opportunity Amid the Structural Growth of AI Memory August 14, 2026 IR AI Infra Analyst semiconductor market
[AI Infrastructure Insight] What is changing inside AI data centers? August 10, 2026 TECH&AI AI AI data center AI Infrastructure AI Memory
SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand August 7, 2026 PRESS AI Infra Cheongju semiconductor semiconductor industry Yongin Semiconductor Cluster
The Next-Generation Memory Architecture in the AI Era? SK hynix Charts the Direction at ‘FMS 2026’ August 7, 2026 TECH&AI CXL DRAM FMS HBF HBM NAND SSD