Businessfeatured SK hynix Strengthens AI Memory Leadership & Partnership With Host at the TSMC 2024 Tech Symposium SK hynix’s booth at the TSMC 2024 Technology Symposium SK hynix showcased its next-generation… April 25, 2024 user Love1
Press Releasefeatured SK hynix Announces 1Q24 Financial Results Revenues at 12.43 trillion won, operating profit at 2.886 trillion won, net profit at 1.917… April 24, 2024 user Love2
Press Releasefeatured SK hynix to Produce DRAM From M15X in Cheongju News Highlights Investment of more than 20 trillion won aimed at preemptively responding to soaring… April 24, 2024 user Love2
Culture & Peoplefeatured The Books That Changed Us: SK hynix Employees Reveal Lessons Learned From Their Favorite Titles on World Book Day Books are great companions. They raise and answer questions. Open up new worlds and offer… April 23, 2024 user Love3
Culture & Peoplefeatured New Leadership Spotlight: Global RTC Head Jaeyun Yi Aims to Present a New Paradigm for the Future of Semiconductors Jaeyun Yi was appointed as the head of SK hynix’s Global Revolutionary Technology Center (RTC),… April 22, 2024 user Love3
Press Releasefeatured SK hynix Partners with TSMC to Strengthen HBM Technological Leadership News Highlights SK hynix and TSMC sign MOU to collaborate on HBM4 development and next-generation… April 19, 2024 user Love3
ESGfeatured SK hynix Wins IFR Asia Award for Innovative Sustainability Bond SK hynix received the Best ESG Bond award at the 2023 IFR Asia Awards for… April 17, 2024 user Love4
Press Releasefeatured Q1 2024 Earnings Conference Call Invitation SK hynix Inc. will present its first quarter earnings on April 25th, 2024 (Thu). A… April 16, 2024 user Love2
Culture & Peoplefeatured Top Team Insights: “Embrace Limitless Challenges to Strengthen Advanced Packaging Tech,” Motto of P&T Head Woojin Choi The SK hynix Newsroom is running a series of interviews with the Top Team—the executives… April 11, 2024 user Love3
Press Releasefeatured SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana News Highlights To build advanced packaging facility for next-generation HBM, while collaborating with Purdue University… April 3, 2024 user Love2
