SK hynix received 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM
April 25, 2026
HBM
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“Overcoming Technological Limits Requires the Integration of Memory and Logic”: SK hynix Presents Vision at TSMC SymposiumApril 23, 2026 -
Chey Tae-won, Chairman of SK Group, Attends GTC 2026 for First Time, Strengthens Role as “Innovation Partner” in AI EcosystemMarch 17, 2026 -
SK hynix Reaffirms Partnership With NVIDIA at GTC 2026, Unveiling Latest AI Memory PortfolioMarch 16, 2026 -
SK hynix to Showcase AI Memory Leadership at NVIDIA GTC 2026March 16, 2026 -
Chairman Chey Tae-won Joins Hands with Zuckerberg — From AI Chips to AI Glasses, Connected by MemoryFebruary 13, 2026 -
“From Chips to Cloud, SK and MS Connect the Dots”… Chairman Chey Tae-won Expands AI Partnership in SeattleFebruary 13, 2026 -
“Designing the Future of AI Chips — Together”… Chairman Chey Tae-won and CEO Hock Tan Declare ‘One Team’February 13, 2026 -
SK Group Chairman Chey Tae-won and NVIDIA CEO Jensen Huang Meet To Discuss ‘AI One-Team Meeting’February 13, 2026 -
SK hynix CEO Kwak Noh-Jung Finds Way Forward for AI Memory on the Ground at CES 2026January 8, 2026 -
[Exploring the AI Ecosystem] How SK hynix is Driving AI’s FutureOctober 16, 2025 -
[Exploring the AI Ecosystem] How SK hynix’s Industry-Leading Memory Fuels AI InnovationSeptember 18, 2025