New Leadership Spotlight: Vice President Hoyoung Son Targets SK hynix’s Evolution Into Total AI Memory Provider Through Advanced Packaging Tech February 27, 2024 STORY Advanced Packaging Haedong Young Engineer Award HBM New Leadership Spotlight TSV
New Leadership Spotlight: Vice President Kitae Kim, Head of HBM Sales & Marketing, on Future-Proofing HBM’s Market Leadership February 21, 2024 STORY HBM Marketing New Leadership Spotlight Sales
Top Team Insights: “Overcome Inertia With Innovation”, AI Infra Head Justin Kim’s Strategy in the AI Era February 7, 2024 STORY AI Infra HBM Top Team Insights
SK hynix Displays Next-Gen Solutions Set to Unlock AI & More at OCP Global Summit 2023 October 20, 2023 TECH&AI AiM Computer Memory Solution CXL eSSD GDDR6-AiM Generative AI HBM LPDDR CAMM OCP Global Summit Open Computer Project PCIe Gen5
SK hynix Develops World’s Best Performing HBM3E, Provides Samples to Customer for Performance Evaluation August 21, 2023 PRESS AI application DRAM HBM HBM3E SK hynix
Strengthening HBM Market Leadership: Meet the SK hynix Team Behind the World’s First 12-Layer HBM3 May 19, 2023 TECH&AI 12-layer EMC HBM HBM3 MR-MUF
[We Do Future Technology] Become a Semiconductor Expert with SK hynix – HBM May 2, 2023 TECH&AI DRAM HBM HBM3 Memory We Do Future Technology
Competitive Edge on Speed Is the Key to HBM Products’ Success November 24, 2022 TECH&AI DRAM HBM HBM Design HBM3
Continuing to Make HBM History: The Story of SK hynix’s HBM Development September 8, 2022 TECH&AI DRAM HBM HBM2 HBM2E HBM3 Memory
“First Movers on a Path That No-one Has Taken Before” – Meet the Engineers Leading the World’s First Mass-production of HBM3 June 22, 2022 TECH&AI HBM HBM2E HBM3
Creating New Values in DRAM Using Through-Silicon-Via Technology for Continued Scaling in Memory System Performance and Capacity November 20, 2019 TECH&AI HBM HBM2 HBM2E TSV