SK hynix VP Munphil Park Aims to Strengthen AI Memory Leadership Through HBM Quality Verification, Customer Certification & Collaboration September 4, 2024 STORY AI Memory HBM HBM Business HBM PE Product Engineering SUPEX Award
Top Team Insights: “Procurement Is Key to Enhancing Our AI Memory Competitiveness Amid Global Instability”, Strategy of FE Procurement Head Seonghan Kim August 22, 2024 STORY AI Memory HBM procurement supply chain Top Team Insights
SK hynix VP Gyujei Lee Targets Continued HBM Success With Next-Gen Packaging Technology August 5, 2024 STORY Advanced Packaging HBM MR-MUF SUPEX Award TSV
[Rulebreakers’ Revolutions] How MR-MUF’s Heat Control Breakthrough Elevated HBM to New Heights July 30, 2024 TECH&AI HBM Heat Control MR-MUF New Material Packaging Rulebreakers Rulebreakers' Revolutions SK hynix
SK hynix Board Approves Yongin Semiconductor Cluster Investment Plan July 26, 2024 PRESS AI Memory HBM Investment Semiconductor Fab Yongin Cluster
SK hynix’s HBM Design Head Myeong-Jae Park: “Unrivalled Tech Prowess Key to Our HBM Success” June 27, 2024 STORY AI AI Memory HBM HBM Design HBM3E SUPEX Award
SK hynix Strengthens AI Memory Leadership & Partnership With Host at the TSMC 2024 Tech Symposium April 25, 2024 TECH&AI AI AI Memory CoWoS HBM HBM3E TSMC TSMC 2024 Tech Symposium TSMC Technology Symposium
SK hynix to Produce DRAM From M15X in Cheongju April 24, 2024 PRESS AI AI Memory Cheongju DRAM HBM M15X
SK hynix Partners with TSMC to Strengthen HBM Technological Leadership April 19, 2024 PRESS AI Memory CoWoS HBM HBM4 MOU Packaging Technology TSMC
Top Team Insights: “Embrace Limitless Challenges to Strengthen Advanced Packaging Tech,” Motto of P&T Head Woojin Choi April 11, 2024 STORY Advanced Packaging HBM MR-MUF Package & Test Top Team Insights TSV
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana April 3, 2024 PRESS Advanced Packaging AI AI Memory HBM Indiana Investment Purdue University
New Leadership Spotlight: Head of HBM PI Unoh Kwon Aims to Finish SK hynix’s HBM Roadmap & Lead in the AI Era March 28, 2024 STORY AI Infra AI Memory HBM HBM Business HKMG New Leadership Spotlight