SK hynix Mass Produces In-house UFS 2.1 Solution

Seoul, August 18, 2016

SK hynix Inc. (or ‘the Company’, www.skhynix.com) announced it has started to mass produce UFS(Universal Flash Storage) 2.1 128/64/32GB(Gigabytes) solution based on its own 2nd generation 3D NAND Flash, in-house firmware and controller. This UFS 2.1 represents a groundbreaking leap in performance by enabling High-Speed Gear 3 interface with dual data lanes. Combined with mobile processors such as Intel’s Cannonlake®, the interface can exhibit even higher performance than legacy interfaces.

The UFS 2.1 is the world’s fastest embedded flash memory for mobile IT devices which drives a remarkable boost in reading/writing speed at low power and supports high density. The Company’s UFS 2.1 operates at 800MB/s(Megabytes per second) and 200MB/s of sequential read/write speed. In consequence, it works more than three times faster in read speed than eMMC 5.1 does.

“SK hynix is pleased to expect the mobile gadgets such as smartphones to enhance their performances with this advanced UFS 2.1” said Vice President SooHwan Choi, the Head of NAND Product Planning Office. “Consumers who use those smartphones with this UFS 2.1 will enjoy 8K resolution and 360 degrees videos and burst photoshoots of raw image formats” he added.

UFS has been used mainly for installation in high-end flagship smartphone models since last year. According to IHS Technology, the share of UFS in mobile embedded memory, based on units, will take 10% in this year and grow up to 26% in 2018 and 45% in 2020.

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), Flash memory chips (“NAND Flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com.