In recent years, semiconductor companies are placing increased focus on packaging technology as it offers enhanced value to the industry. Even companies that have previously concentrated on technology for semiconductor memory manufacturing are investing more in packaging technology than Outsourced Semiconductor Assembly and Test (OSAT) companies that specialize in such technology.
Packaging technology has four main functions. It protects the semiconductor chip from external shock or damage, provides external power and wiring to the chip, and properly distributes heat generated by the chip to ensure stable operation. Additionally, packaging technology acts as a bridge by connecting the gaps existing between semiconductor devices and systems.
Over the past two decades, packaging technology has evolved significantly. These developments include stacking multiple chips onto one package and including chip bumps for interconnection that shortened the signal path to achieve faster operating speeds. Most recently, packaging technology can be considered a system solution by itself as it’s capable of connecting various types of chips into one package and many parts into one module when incorporating a system.
In this EE Times article by Ki-ill Moon, head of Package Technology Development at SK hynix, the author details how SK hynix’s packaging technologies such as Chip-on-Chip (CoC) and Mass Reflow Molded Underfill (MR-MUF) produced vast improvements in speed, cost, and quality.
Today, SK hynix is leading the packaging revolution as it has been mass-producing advanced packaging products based on HBM3 and focusing on investing in production lines and securing resources for the development of future packaging technologies such as heterogenous integration and Fan-out RDL.
As SK hynix always strives to maintain its leadership position in today’s semiconductor memory industry, the company will continue to make innovative efforts to advance its packaging technologies and become a total “solution provider.”
Learn more about the evolution of packaging technology by reading the EE Times article: The Value of Semiconductor Packaging Technology in the Era of Heterogeneous Integration
