SK hynix’s Kangwook Lee Becomes First South Korean to Win IEEE EPS’ Electronics Manufacturing Technology Award May 31, 2024 STORY Electronics Manufacturing Technology Award Electronics Packaging Society IEEE semiconductor packaging
New Leadership Spotlight: SK hynix Execs Join Roundtable to Discuss Company’s AI Memory Leadership & Future Market Trends May 30, 2024 STORY AI memory leadership Executive Roundtable New Leadership Spotlight
The Books That Changed Us: SK hynix Employees Reveal Lessons Learned From Their Favorite Titles on World Book Day April 23, 2024 STORY Career Development Life Lessons World Book Day
New Leadership Spotlight: Global RTC Head Jaeyun Yi Aims to Present a New Paradigm for the Future of Semiconductors April 22, 2024 STORY EmergingMemory Global RTC New Leadership Spotlight ORP Revolutionary Technology Center
SK hynix Wins IFR Asia Award for Innovative Sustainability Bond April 17, 2024 STORY ESG Green Bond IFR PRISM SLB Social Value Sustainability SV
Top Team Insights: “Embrace Limitless Challenges to Strengthen Advanced Packaging Tech,” Motto of P&T Head Woojin Choi April 11, 2024 STORY Advanced Packaging HBM MR-MUF Package & Test Top Team Insights TSV
SK hynix Teams Up With Local Partners to Develop Pioneering Neon Gas Recycling Tech April 1, 2024 STORY ESG Excimer Laser Materials neon Net Zero Photolithography Recycle TEMC
New Leadership Spotlight: Head of HBM PI Unoh Kwon Aims to Finish SK hynix’s HBM Roadmap & Lead in the AI Era March 28, 2024 STORY AI Infra AI Memory HBM HBM Business HKMG New Leadership Spotlight
Leadership Spotlight: Deoksin Kil, Head of Material Development, On Achieving Tech Innovation Through Advanced Materials March 13, 2024 STORY EUV PR Infra Tech Center Materials New Leadership Spotlight
Women of SK hynix Reveal Inspirational Beliefs on International Women’s Day 2024 March 7, 2024 STORY DEI diversity ESG inclusion International Women's Day IWD PRISM
New Leadership Spotlight: Vice President Hoyoung Son Targets SK hynix’s Evolution Into Total AI Memory Provider Through Advanced Packaging Tech February 27, 2024 STORY Advanced Packaging Haedong Young Engineer Award HBM New Leadership Spotlight TSV
New Leadership Spotlight: Vice President Kitae Kim, Head of HBM Sales & Marketing, on Future-Proofing HBM’s Market Leadership February 21, 2024 STORY HBM Marketing New Leadership Spotlight Sales