Culture & Peoplefeatured Top Team Insights: “Embrace Limitless Challenges to Strengthen Advanced Packaging Tech,” Motto of P&T Head Woojin Choi The SK hynix Newsroom is running a series of interviews with the Top Team—the executives… April 11, 2024 user Love0
Press Releasefeatured SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana News Highlights To build advanced packaging facility for next-generation HBM, while collaborating with Purdue University… April 3, 2024 user Love0
Culture & Peoplefeatured New Leadership Spotlight: Vice President Hoyoung Son Targets SK hynix’s Evolution Into Total AI Memory Provider Through Advanced Packaging Tech SK hynix has ramped up preparations for its evolution in the AI era with a… February 27, 2024 user Love0
