Technology SK hynix: Leading Revolutions for Nearly 40 Years Since 1983, SK hynix has ventured through numerous changes and crises, thereby transforming the company… March 18, 2021 user Love0
Technology Encapsulation Process, A Way of Sealing Packages The “encapsulation process”, which encapsulates packages, is a step where a semiconductor chip is wrapped… March 18, 2021 user Love0
Technology Wire Bonding, a Way to Stitch Chips to PCBs To each sheet of wafers that have completed the front-end process, 500 to 1,200 chips,… March 4, 2021 user Love0
Technology Die Bonding, Process for Placing a Chip on a Package Substrate A packaging process, which is a back-end process for manufacturing semiconductors, proceeds in the order… February 25, 2021 user Love0
Technology Why SK hynix continues to raise the bar At SK hynix, we understand rapid technology shifts and the needs of our customers innately.… February 18, 2021 user Love0
Technology “Marvel’s Spider-Man: Miles Morales”, Another Masterpiece Realized by Semiconductors The excitement from jumping around the skyscrapers of Manhattan in New York City, the joy… February 18, 2021 user Love0
Technology Celebrating our Inventors at SK hynix In 1983, then-President Ronald Regan issued Proclamation 5013. In it, he designated February 11 --… February 10, 2021 user Love0
Technology Back to School: A Look at Hybrid Learning When a global pandemic forced children around the world out of their classrooms nearly a… February 4, 2021 user Love0
Technology [In-Depth Analysis of CES 2021] Semiconductor Grows from an “Unsung Hero” to the “Biggest Trend” The International Consumer Electronics Show (CES), the world’s largest home appliance and IT trade show,… January 27, 2021 user Love0
