Technology

Die Bonding, Process for Placing a Chip on a Package Substrate

A packaging process, which is a back-end process for manufacturing semiconductors, proceeds in the order…

February 25, 2021

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Why SK hynix continues to raise the bar

At SK hynix, we understand rapid technology shifts and the needs of our customers innately.…

February 18, 2021

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“Marvel’s Spider-Man: Miles Morales”, Another Masterpiece Realized by Semiconductors

The excitement from jumping around the skyscrapers of Manhattan in New York City, the joy…

February 18, 2021

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Celebrating our Inventors at SK hynix

In 1983, then-President Ronald Regan issued Proclamation 5013. In it, he designated February 11 --…

February 10, 2021

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Back to School: A Look at Hybrid Learning

When a global pandemic forced children around the world out of their classrooms nearly a…

February 4, 2021

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[In-Depth Analysis of CES 2021] Semiconductor Grows from an “Unsung Hero” to the “Biggest Trend”

The International Consumer Electronics Show (CES), the world’s largest home appliance and IT trade show,…

January 27, 2021

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Singulation, the Moment When a Wafer is Separated into Multiple Semiconductor Chips

A wafer goes through three changes until it becomes a semiconductor chip. The process for…

January 21, 2021

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Three Thoughts: A Look at the Future of Virtual Reality

Last year, as the potential for virtual reality applications to reach the mainstream continued to…

January 21, 2021

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[Future Semiconductor Technology] The Present of the Next-Generation Ultra-Low-Power MRAM Technology

With the development of information and communication technology (ICT), the amount of information that humans…

January 14, 2021

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