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Lee has over 27 years of research experience in 3D packaging and integrated circuits
Lee has over 27 years of research experience in 3D packaging and integrated circuits
The Dawon Kahng Award recognizes outstanding talents in the semiconductor industry
The Dawon Kahng Award recognizes outstanding talents in the semiconductor industry
Lee is a recognized leader in semiconductor packaging technology
Lee is a recognized leader in semiconductor packaging technology
Lee is a recognized leader in semiconductor packaging technology
Lee is a recognized leader in semiconductor packaging technology